Ul Recognized 3.0 W/Mk Thermal Gap Filler Material 2.5mmt For Notebook

Product Categories

Phase Changing Materials [41]
Thermal Conductive Pad [188]
Thermal Gap Filler [220]
Thermal Conductive Grease [28]
Thermal Insulation Materials [48]
Thermal Graphite Sheet [57]
Thermal Adhesive Tape [47]
Thermal Conductive Glue [15]
Thermal Conductive Adhesive [13]
Thermal Conductive Plastic [23]
Sponge Foam Material [13]
PET Double Sided Tape [11]
Thermal Gap Pad [406]
Thermal Conductive Gel [24]
Silicone Foam Gasket [11]
Silicone Free Gap Filler Pad [12]
Shielding Absorbing Materials [19]
Thermal Conductivity Sharp Metal [2]

Dongguan Ziitek Electronic Materials & Technology Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

Ul Recognized 3.0 W/Mk Thermal Gap Filler Material 2.5mmt For Notebook

Contact Now

Ul Recognized 3.0 W/Mk Thermal Gap Filler Material 2.5mmt For Notebook

new type Moldability for complex parts UL recognized 3.0 W/mK thermal conductive pad for notebook,2.5mmT The TIF1100-30-06US use a special process, with silicone as the base material, adding thermal ...

Product Tags:

3 w mk thermal gap filler material

notebook thermal gap filler material

notebook gap pad

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Dongguan Ziitek Electronic Materials & Technology Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

Friendly Links: www.everychina.com