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Specific Gravity 3.3 G/Cm^3 Moldability For Complex Parts Memory Modules Silicone Pads

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Specific Gravity 3.3 G/Cm^3 Moldability For Complex Parts Memory Modules Silicone Pads

Name: Specific Gravity 33 GCm3 Moldability For Complex Parts Memory Modules Silicone Pads
Brand: ZIITEK
Price: 1 USD

Specific Gravity 3.3 G/Cm^3 Moldability For Complex Parts Memory Modules Silicone Pads Manufactures

Brand Name : ZIITEK

Model Number : TIF760HM thermal pad

Certification : UL

Place of Origin : China

MOQ : 1000pcs

Price : negotiation

Supply Ability : 100000pcs/day

Delivery Time : 3-5 work days

Packaging Details : 1000pcs/bag

Thickness : 1.5mmT

keyword : thermal gap pad

name : Specific Gravity 3.3 g/cm^3 Moldability for Complex Parts Memory Modules Silicone Pads

Volume Resistiviyt : 1.0X10^12 Ohm-cm

part number : TIF760HM

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Specific Gravity 3.3 g/cm^3 Moldability for Complex Parts Memory Modules Silicone Pads

The TIF760M thermal silicone pad is a product with both performance and economy. It is a unique thermal pad with low oil permeability, low thermal resistance, high softness and high compliance.It can work stably at -40℃~160℃ and meet the requirement of UL94V0.

TIF700HM-Series-Datasheet.pdf

Features

> Good thermal conductive: 6.0 W/mK

> Thickness: 1.5mmT

> hardness:45±5 shore 00

> Colour: Grey

> Moldability for complex parts
> Soft and compressible for low stress applications
> Naturally tacky needing no further adhesive coating

Applications

>mainboard/mother board

>notebook

>power supply

>Heat pipe thermal solutions

>Memory Modules

>Mass storage devices

Typical Properties of TIF760HM Series
Color	Grey	Visual	Composite Thickness	Thermal Impedance@10psi (℃-in²/W)
Construction & Compostion	Ceramic filled silicone elastomer	***	10mils / 0.254 mm	0.16
			20mils / 0.508 mm	0.20
Specific gravity	3.3 g/cm³	ASTM D297	30mils / 0.762 mm	0.31
			40mils / 1.016 mm	0.36
Thickness	1.5mmT	***	50mils / 1.270 mm	0.42
			60mils / 1.524 mm	0.48
Hardness	45±5 Shore 00	ASTM 2240	70mils / 1.778 mm	0.53
			80mils / 2.032 mm	0.63
Thermal conductivity	6.0W/mk	ISO22007-2.2	90mils / 2.286 mm	0.73
			100mils / 2.540 mm	0.81
Continuos Use Temp	-40 to 160℃	***	110mils / 2.794 mm	0.86
			120mils / 3.048 mm	0.93
Dielectric Breakdown Voltage	>5500 VAC	ASTM D149	130mils / 3.302mm	1.00
			140mils /3.556 mm	1.08
Dielectric Constant	4.5MHz	ASTM D150	150mils / 3.810 mm	1.13
			160mils / 4.064 mm	1.20
Volume Resistivity	1.0X10¹² Ohm-cm	ASTM D257	170mils / 4.318 mm	1.24
			180mils / 4.572 mm	1.32
Fire rating	94 V0	equivalent UL	190mils / 4.826 mm	1.41
			200mils / 5.080 mm	1.52
Thermal conductivity	6.0 W/m-K	ASTM D5470	Visua l/ ASTM D751	ASTM D5470

Company Profile

With a wide range, good quality, reasonable prices and stylish designs, Ziitek thermal conductive interface materials are extensively used in Mainboards, VGA cards, Notebooks, DDR&DDR2 products, CD-ROM ,LCD TV, PDP products, Server Power products, Down lamps, Spotlights, Street lamps, Daylight lamps, LED Server Power products and others.

Standard Sheets Sizes:

8" x 16"(203mm x 406mm)

TIF™ series Individual die cut shapes can be supplied.

Specific Gravity 3.3 G/Cm^3 Moldability For Complex Parts Memory Modules Silicone Pads

FAQ:

Q: Do you accept custom orders ?

A:Yes , welcome to custom orders. Our custom elements including dimension , shape , color and coated on side or two sides adhesive or coated fiberglass. If you want to place a custom order , pls kindly offer a drawing or leave your custom order information .

Q: How much are the pads?

A: Price is depended on your size, thickness, quantity, and other requirements, such as adhesive and others. Please let us know these factors first so that we could give you an exact price.

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Specific Gravity 3.3 G/Cm^3 Moldability For Complex Parts Memory Modules Silicone Pads

Specific Gravity 3.3 G/Cm^3 Moldability For Complex Parts Memory Modules Silicone Pads

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